Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation

Chieh Pu Tsai, Chung Yu Chiu, Wei Chieh Huang, Cheng Yi Liu, Jui Shen Chang, Chen Nan Chiu, Yao Chun Chuang

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

The heterogeneous nucleation on the limited (Pd,Ni)Sn4 compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn4 compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni3P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.

Original languageEnglish
Article number135729
JournalMaterials Letters
Volume357
DOIs
StatePublished - 15 Feb 2024

Keywords

  • Electromigration
  • Micro-bumps
  • Nucleation
  • Solidification
  • Undercooling

Fingerprint

Dive into the research topics of 'Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation'. Together they form a unique fingerprint.

Cite this