Screen-printed nanostructured composites as thermal interface materials for insulated gate bipolar transistors heat dissipation applications

Tien Chan Chang, Yiin Kuen Fuh, Rui Zhong Lee, Liu Li-Yuan, Yueh Mu Lee

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Thermal interface materials (TIMs) are of crucial importance in enhancing heat transfer and minimizing exceedingly high temperatures in high-density electronics. TIMs functionally aim to reduce the microscale crevices by penetrating the gap between the contacting rigid surfaces. We prepared silver nanoparticles (SNPs) and single-wall carbon nanotubes (SWCNTs)-based nanocomposites with graphite nanoplatelets (GNPs) by using a screen printing technique for conformal spreading of SNPs and SWCNTs with various weight-loading ratios on top of a layer containing the GNPs and measured its thermal conductivity and electrical conductivities in both through-plane and in-plane directions. In particular, the 10% SNPs enhanced TIMs showed highly anisotropic behavior in both electrical and thermal conductivities, viz., in-plane electrical conductivity exceeds its through-plane counterpart by three orders of magnitude, the highest in-plane electrical conductivity was 7.85 S/cm, and through-plane electrical conductivity was 0.00287 S/cm. Similarly, anisotropic behavior was found for the in-plane thermal conductivity ∼8.4 W/mK and through-plane thermal conductivity ∼0.35943 W/mK. In addition, scanning electron microscopy (SEM) was performed to reveal the typical morphology and elements' existence of screen-printed TIMs. The proposed TIMs were put into the actual 15-kW converter to test the thermal management performance.

Original languageEnglish
Article number044503
JournalJournal of Micro/Nanolithography, MEMS, and MOEMS
Volume15
Issue number4
DOIs
StatePublished - 1 Oct 2016

Keywords

  • direct bonded copper
  • graphite nanoplatelets
  • insulated gate bipolar transistors
  • scanning electron microscopy
  • silver nanoparticles
  • single-wall carbon nanotubes
  • thermal interface materials

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