Scream for multi-level movable structures by inductively coupled plasma process

Yu Hsin Lin, Hung Ling Yin, Yung Yu Hsu, Yi Chiuen Hu, Hsiao Yu Chou, Tsung Hsun Yang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations


A novel fabrication process to etch, to passivate, and to release single-crystal silicon structures totally in just only one process by inductively coupled plasma reactive ion etching (ICP-RIE) has been presented in this paper. Several kinds of movable actuators such as relay, comb-drive, and capacitance with thickness of 30• m have been fabricated successfully to demonstrate this fabrication process. Here, experimental investigations about fabrication parameters to get well profile and suspension structures are performed in a STS ICP-RIE system.

Original languageEnglish
Title of host publicationMicroelectromechanical Systems
PublisherAmerican Society of Mechanical Engineers (ASME)
Number of pages4
ISBN (Print)0791836428, 9780791836422
StatePublished - 2002

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings


  • Actuators
  • Inductively coupled plasma reactive ion etching (ICP-RIE)
  • Micro-Electro-Mechanical systems (MEMS)


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