Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders

S. J. Wang, C. Y. Liu

Research output: Contribution to journalArticlepeer-review

69 Scopus citations

Abstract

Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders was analyzed. The 5 μm Ni(P) was found to be consumed after 5 min of reflowing. The spalling of Ni-Sn compound grains enhanced the formation of a gap forming at the Ni3O/Cu interface.

Original languageEnglish
Pages (from-to)813-818
Number of pages6
JournalScripta Materialia
Volume49
Issue number9
DOIs
StatePublished - Nov 2003

Keywords

  • Ni(P)
  • Pb-free solder
  • Sn(Cu) alloys

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