Reliability of micro-interconnects in 3D IC packages

Research output: Contribution to journal › Editorial

9 Scopus citations

Original language	English
Pages (from-to)	1
Number of pages	1
Journal	Microelectronics Reliability
Volume	53
Issue number	1
DOIs	https://doi.org/10.1016/j.microrel.2012.11.005
State	Published - Jan 2013

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title = "Reliability of micro-interconnects in 3D IC packages",

author = "\{Robert Kao\}, C. and Wu, \{Albert T.\} and Tu, \{King Ning\} and Lai, \{Yi Shao\}",

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T1 - Reliability of micro-interconnects in 3D IC packages

AU - Robert Kao, C.

AU - Wu, Albert T.

AU - Tu, King Ning

AU - Lai, Yi Shao

PY - 2013/1

Y1 - 2013/1

UR - https://www.scopus.com/pages/publications/84872105777

U2 - 10.1016/j.microrel.2012.11.005

DO - 10.1016/j.microrel.2012.11.005

M3 - 編者言

AN - SCOPUS:84872105777

SN - 0026-2714

VL - 53

SP - 1

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 1

ER -