Reliability of micro-interconnects in 3D IC packages

C. Robert Kao, Albert T. Wu, King Ning Tu, Yi Shao Lai

Research output: Contribution to journal › Editorial

8 Scopus citations

Original language	English
Pages (from-to)	1
Number of pages	1
Journal	Microelectronics Reliability
Volume	53
Issue number	1
DOIs	https://doi.org/10.1016/j.microrel.2012.11.005
State	Published - Jan 2013

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AU - Wu, Albert T.

AU - Tu, King Ning

AU - Lai, Yi Shao

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