Original language | English |
---|---|
Pages (from-to) | 761 |
Number of pages | 1 |
Journal | Microelectronics Reliability |
Volume | 52 |
Issue number | 5 |
DOIs | |
State | Published - May 2012 |
Reliability of high-power LED packaging and assembly
Cheng Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi Shao Lai
Research output: Contribution to journal › Editorial
1
Scopus
citations