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Recent Advances in Thermoplastic Microfluidic Bonding
Kiran Giri,
Chia Wen Tsao
Department of Mechanical Engineering
Research output
:
Contribution to journal
›
Review article
›
peer-review
39
Scopus citations
Overview
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Keyphrases
Recent Advances
100%
Bonding Process
100%
Thermoplastic Microfluidics
100%
Microfluidic Device
66%
Microfluidic Applications
33%
Organic Solvents
33%
Acid-base
33%
Low Water
33%
Microfluidics
33%
Polymer Microfluidics
33%
Energy Chemical
33%
Mechanical Rigidity
33%
Base Resistivity
33%
Bonding Strategy
33%
Multidisciplinary Technologies
33%
Solvent Resistivity
33%
Water Absorbance
33%
Device Assembly
33%
Energy Environment
33%
Bonding Requirements
33%
Engineering
Microfluidic Device
100%
Chemical Energy
50%
Bonding Process
50%
Review Paper
50%
Mechanical Rigidity
50%
Material Science
Thermoplastics
100%
Electrical Resistivity
40%
Organic Solvents
20%
Rigidity
20%