We present an experimental study of the wetting behavior of Pb on flat and grooved Cu surfaces. The alloying of even 1–2 wt. % Sn into Pb can lead to dramatic changes in wetting angle and length flow into the grooves. The observed flow behavior disagrees with models based on the classical Washburn flow [E. W. Washburn, Phys. Rev. 17, 273 (1921)]. We conclude that the driving force of reactive wetting must take into account, besides the capillary force, the free energy change due to intermetallic compound formation.
|Number of pages||4|
|Journal||Physical Review E - Statistical, Nonlinear, and Soft Matter Physics|
|State||Published - 1998|