Pulse plating effects during Ni-W electrodeposition

Sheng Long Lee; Yuang Fa Lee; Ming Hon Chang; Jing Chie Lin

Pulse plating effects during Ni-W electrodeposition

Sheng Long Lee, Yuang Fa Lee, Ming Hon Chang, Jing Chie Lin

Graduate Institute of Materials Science and Engineering

Research output: Contribution to specialist publication › Article

12 Scopus citations

Abstract

THE TUNGSTEN content and current efficiency of Ni-W alloy deposits from pulse plating I were lower than those from direct-current (dc) plating at an average current density of 10A/dm². Deposits with a higher tungsten content have an amorphous structure. It is shown that pulse plating can improve surface roughness. Furthermore, the hardness and corrosion resistance of deposits in 3% NaCl solution with pH6.8 increased with tungsten content. Also, the weight-loss data from the dry wear show a good reciprocal correlation with hardness.

Original language	English
Pages	71-76
Number of pages	6
Volume	46
No	3
Specialist publication	Corrosion Prevention and Control
State	Published - Jun 1999

Cite this

@misc{18a5819e02c24b8a8f02dab1e077f7a3,

title = "Pulse plating effects during Ni-W electrodeposition",

abstract = "THE TUNGSTEN content and current efficiency of Ni-W alloy deposits from pulse plating I were lower than those from direct-current (dc) plating at an average current density of 10A/dm2. Deposits with a higher tungsten content have an amorphous structure. It is shown that pulse plating can improve surface roughness. Furthermore, the hardness and corrosion resistance of deposits in 3% NaCl solution with pH6.8 increased with tungsten content. Also, the weight-loss data from the dry wear show a good reciprocal correlation with hardness.",

author = "Lee, {Sheng Long} and Lee, {Yuang Fa} and Chang, {Ming Hon} and Lin, {Jing Chie}",

year = "1999",

month = jun,

language = "???core.languages.en_GB???",

volume = "46",

pages = "71--76",

journal = "Corrosion Prevention and Control",

issn = "0010-9371",

}

TY - GEN

T1 - Pulse plating effects during Ni-W electrodeposition

AU - Lee, Sheng Long

AU - Lee, Yuang Fa

AU - Chang, Ming Hon

AU - Lin, Jing Chie

PY - 1999/6

Y1 - 1999/6

N2 - THE TUNGSTEN content and current efficiency of Ni-W alloy deposits from pulse plating I were lower than those from direct-current (dc) plating at an average current density of 10A/dm2. Deposits with a higher tungsten content have an amorphous structure. It is shown that pulse plating can improve surface roughness. Furthermore, the hardness and corrosion resistance of deposits in 3% NaCl solution with pH6.8 increased with tungsten content. Also, the weight-loss data from the dry wear show a good reciprocal correlation with hardness.

AB - THE TUNGSTEN content and current efficiency of Ni-W alloy deposits from pulse plating I were lower than those from direct-current (dc) plating at an average current density of 10A/dm2. Deposits with a higher tungsten content have an amorphous structure. It is shown that pulse plating can improve surface roughness. Furthermore, the hardness and corrosion resistance of deposits in 3% NaCl solution with pH6.8 increased with tungsten content. Also, the weight-loss data from the dry wear show a good reciprocal correlation with hardness.

UR - http://www.scopus.com/inward/record.url?scp=0040886233&partnerID=8YFLogxK

M3 - 文章

AN - SCOPUS:0040886233

VL - 46

SP - 71

EP - 76

JO - Corrosion Prevention and Control

JF - Corrosion Prevention and Control

SN - 0010-9371

ER -

Pulse plating effects during Ni-W electrodeposition

Abstract

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