Pulse plating effects during Ni-W electrodeposition

Sheng Long Lee, Yuang Fa Lee, Ming Hon Chang, Jing Chie Lin

Research output: Contribution to specialist publicationArticle

12 Scopus citations

Abstract

THE TUNGSTEN content and current efficiency of Ni-W alloy deposits from pulse plating I were lower than those from direct-current (dc) plating at an average current density of 10A/dm2. Deposits with a higher tungsten content have an amorphous structure. It is shown that pulse plating can improve surface roughness. Furthermore, the hardness and corrosion resistance of deposits in 3% NaCl solution with pH6.8 increased with tungsten content. Also, the weight-loss data from the dry wear show a good reciprocal correlation with hardness.

Original languageEnglish
Pages71-76
Number of pages6
Volume46
No3
Specialist publicationCorrosion Prevention and Control
StatePublished - Jun 1999

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