Physical characteristics of nanoscale titanium-aluminum alloy powder during 3D printing laser sintering process - A molecular dynamics study

Ling Feng Lai, Deng Maw Lu, Chun Hsien Li, Kun Hsien Chen, Shun Chang Lin, Yu Chen Su, Shan Jiang, Day Shan Liu, Kuei Shu Hsu, Jian Ming Lu, Ming Hsiao Lee, Zhen Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

In the study, the molecular dynamics simulation method is utilized to investigate the physical characteristics of nanoscale titanium aluminum alloy powder during 3D printing (additive manufacturing) powder bed fusion laser sintering process. The radius of gyration, neck width and root mean square of different powder size of nanoscale titanium aluminum alloy powder during 3D printing laser sintering process under different heating rate is analyzed and discussed. The physical characteristics of nanoscale solid/hollow spherical titanium aluminum binary alloy powder are simulated, and the neck width and internal lattice changes are also observed. It is found that the phenomena of spontaneous solid-state sintering is occurred at room temperature whatever solid or hollow spherical titanium-aluminum alloy nanoscale powder. It is observed that the temperature of solid state diffusion decrease with heating rate increasing, but the temperature of that increase with powder size decreasing. It is found that the coalescence temperature of nanoscale solid titanium aluminum alloy powder is range of between 940K and 1700K, and the melting temperature of that is range of between 1600K and 1770K. It is also observed that the coalescence temperature of nanoscale hollow coalescence temperature is range of between 1050K and 1580K, and the melting temperature of that is range of between 1450K and 1630K.

Original languageEnglish
Title of host publicationProceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018
EditorsArtde Donald Kin-Tak Lam, Stephen D. Prior, Teen-Hang Meen
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1318-1321
Number of pages4
ISBN (Electronic)9781538643426
DOIs
StatePublished - 22 Jun 2018
Event4th IEEE International Conference on Applied System Innovation, ICASI 2018 - Chiba, Japan
Duration: 13 Apr 201817 Apr 2018

Publication series

NameProceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018

Conference

Conference4th IEEE International Conference on Applied System Innovation, ICASI 2018
Country/TerritoryJapan
CityChiba
Period13/04/1817/04/18

Keywords

  • 3D Printing
  • Molecular Dynamics
  • Nanoscale Alloy Powder

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