@inproceedings{78bd389526fa4368a944c15d0b4651df,
title = "PCB embedded capacitor with central via connection structure for RF application",
abstract = "Although PCB embedded passives technology has been studied for several years, there are still many researches continuing to make it more complete and applicable. This work focus on the electrical performance of MIM (metal-insulator- metal) type embedded capacitor. For high frequency application, the self-resonance frequency (SRF) is an important design parameter. Different I/O connection types and positions on the electrode will change the parasitic effect and thus affect SRF. In this paper, an embedded capacitor with central via connection is utilized to enhance the SRF. Since the coupling effect from other nearby components also degrades the characteristic of embedded capacitor, a shielding structure for PCB embedded capacitor is designed to prevent the interference from internal high density routing and keep good electrical performance.",
author = "Chen, {Chang Sheng} and Lin, {Yo Shen} and Chen, {Wei Ting} and Shyu, {Chin Sun} and Lay, {Shinn Juh} and Lee, {Min Lin}",
year = "2008",
doi = "10.1109/EDAPS.2008.4736003",
language = "???core.languages.en_GB???",
isbn = "9781424426331",
series = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings",
pages = "77--80",
booktitle = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings",
note = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 ; Conference date: 10-12-2008 Through 12-12-2008",
}