PCB embedded capacitor with central via connection structure for RF application

Chang Sheng Chen, Yo Shen Lin, Wei Ting Chen, Chin Sun Shyu, Shinn Juh Lay, Min Lin Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Although PCB embedded passives technology has been studied for several years, there are still many researches continuing to make it more complete and applicable. This work focus on the electrical performance of MIM (metal-insulator- metal) type embedded capacitor. For high frequency application, the self-resonance frequency (SRF) is an important design parameter. Different I/O connection types and positions on the electrode will change the parasitic effect and thus affect SRF. In this paper, an embedded capacitor with central via connection is utilized to enhance the SRF. Since the coupling effect from other nearby components also degrades the characteristic of embedded capacitor, a shielding structure for PCB embedded capacitor is designed to prevent the interference from internal high density routing and keep good electrical performance.

Original languageEnglish
Title of host publication2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages77-80
Number of pages4
DOIs
StatePublished - 2008
Event2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
Duration: 10 Dec 200812 Dec 2008

Publication series

Name2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Conference

Conference2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Country/TerritoryKorea, Republic of
CitySeoul
Period10/12/0812/12/08

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