Projects per year
Projects
- 3 Finished
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Finished
Effect of LED Die-Attachment on Stress in GaN Eip-Layers and Anelastic Behavior(3/3)
1/08/17 → 31/07/18
Project: Research
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Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(2/3)
1/08/17 → 31/07/18
Project: Research
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