Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

Zhaoran Huang; Daniel Guidotti; Gee Kung Chang; Jin Liu; Fuhan Liu; Y. J. Chang; Rao Tummala

Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

Zhaoran Huang, Daniel Guidotti, Gee Kung Chang, Jin Liu, Fuhan Liu, Y. J. Chang, Rao Tummala

Department of Optics and Photonics

Research output: Contribution to journal › Conference article › peer-review

1 Scopus citations

Abstract

The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.

Original language	English
Pages (from-to)	13-14
Number of pages	2
Journal	LEOS Summer Topical Meeting
State	Published - 2004
Event	2004 Digest of the LEOS Summer Topical Meetings - San Diego, CA, United States Duration: 28 Jul 2004 → 30 Jul 2004

Cite this

@article{d6352c2f906b40cfa51fd6c0aa1e6af4,

title = "Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices",

abstract = "The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.",

author = "Zhaoran Huang and Daniel Guidotti and Chang, {Gee Kung} and Jin Liu and Fuhan Liu and Chang, {Y. J.} and Rao Tummala",

year = "2004",

language = "???core.languages.en_GB???",

pages = "13--14",

journal = "LEOS Summer Topical Meeting",

issn = "1099-4742",

note = "2004 Digest of the LEOS Summer Topical Meetings ; Conference date: 28-07-2004 Through 30-07-2004",

}

TY - JOUR

T1 - Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

AU - Huang, Zhaoran

AU - Guidotti, Daniel

AU - Chang, Gee Kung

AU - Liu, Jin

AU - Liu, Fuhan

AU - Chang, Y. J.

AU - Tummala, Rao

PY - 2004

Y1 - 2004

N2 - The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.

AB - The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.

UR - http://www.scopus.com/inward/record.url?scp=4544324965&partnerID=8YFLogxK

M3 - 會議論文

AN - SCOPUS:4544324965

SN - 1099-4742

SP - 13

EP - 14

JO - LEOS Summer Topical Meeting

JF - LEOS Summer Topical Meeting

T2 - 2004 Digest of the LEOS Summer Topical Meetings

Y2 - 28 July 2004 through 30 July 2004

ER -

Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

Abstract

Fingerprint

Cite this