On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied d.c. field

J. C. Lin, J. Y. Chan

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Abstract

Silver migration occurring in pure silver conductive thick films was minimized by using Ag-Pd alloys. The in situ microscopic observation, under humid environment and an applied d.c. field, showed that the out-growth of silver dendrites from the cathode decreases with increasing (5-20%) amount of Pd in the Ag-Pd specimens, and ceases completely at 30% Pd. The enhancement of silver migration resistance with increasing Pd concentration in Ag-Pd conductors was evident by the measurements of the short circuit current between a couple of thick-film electrodes in distilled water at 5 V. Through the study of anodic potentiodynamic polarization in 0.01 M NaOH and the examination of the surface films on the thick films by X-ray diffraction and surface analyses (Auger and ESCA), it was found that the anodic formation of PdO blocks the silver dissolution, and minimizes the occurrence of silver migration.

Original languageEnglish
Pages (from-to)256-265
Number of pages10
JournalMaterials Chemistry and Physics
Volume43
Issue number3
DOIs
StatePublished - Mar 1996

Keywords

  • Ag-Pd thick films
  • Anodic polarization
  • Pd concentration
  • Resistance
  • Silver migration

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