On test and repair of 3D random access memory

Cheng Wen Wu, Shyue Kun Lu, Jin Fu Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

13 Scopus citations

Abstract

The three-dimensional (3D) random access memory (RAM) using through-silicon via (TSV) has been considered as a promising approach to overcome the memory wall. However, cost and yield are two key issues for volume production of 3D RAMs, and yield enhancement increasingly requires test techniques. In this paper, we first introduce issues and existing techniques for the testing and yield enhancement of 3D RAMs. Then, a built-in self-repair (BISR) technique for 3D RAM using global redundancy is presented. According to the redundancy analysis results of each die with the BISR circuit, the die-to-die (d2d) and wafer-to-wafer (w2w) stacking problems are transferred to the bipartite maximal matching problem. Then, heuristic algorithms are also proposed to optimize the stacking yield.

Original languageEnglish
Title of host publicationASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference
Pages744-749
Number of pages6
DOIs
StatePublished - 2012
Event17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012 - Sydney, NSW, Australia
Duration: 30 Jan 20122 Feb 2012

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012
Country/TerritoryAustralia
CitySydney, NSW
Period30/01/122/02/12

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