NVDimm-FE: A High-density 3D Architecture of 3-bit/c 2TnC_FEto Break Great Memory Wall with 10 ns of PGM-pulse, 10¹⁰Cycles of Endurance, and Decade Lifetime at 103 °C

E. R. Hsieh, J. K. Chang, T. Y. Tang, Y. J. Li, C. W. Liang, M. Y. Lin, S. Y. Huang, C. J. Su, J. C. Guo, S. S. Chung

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

1 results

Finished
Developments and Applications of AI chip by Neuromorphic Computing: Construction of General Neuron-Network Technology Platform and Hetero-Integration of AI Chip in Recognition of Images(1/3)
Hsieh, E.-R. (PI)
1/02/20 → 31/01/21
Project: Research