Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits

Hsueh Hsien Hsu, Shin Yi Huang, Tao Chih Chang, Albert T. Wu

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

The shrinking solder dimensions greatly impact the reliability of devices and increase entire failure modes. Limited solder volumes can be consumed completely and transformed into intermetallic compound (IMC) microbumps. Microvoids surface when microbumps are formed and may be attributed to a mismatch of the thermal expansion coefficient between the constituents. After thermal aging at 150 °C, the stress induced by the growth of IMCs relaxes and enhances propagation of the cracks along the middle of the bumps. The brittle nature of the IMC showed minimal resistance to cracks and incurred a failure mode.

Original languageEnglish
Article number251913
JournalApplied Physics Letters
Volume99
Issue number25
DOIs
StatePublished - 19 Dec 2011

Fingerprint

Dive into the research topics of 'Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits'. Together they form a unique fingerprint.

Cite this