Nanoscale layer transfer by hydrogen ion-cut processing: A brief review through recent U.S. patents

Benjamin T.H. Lee

Department of Mechanical Engineering

Research output: Contribution to journal › Review article › peer-review

4 Scopus citations

1 results

Finished
Study for Symmetrical Bonded Structure Canceling Thermal Stresses to Realize Wafer Bonding and Layer Transfer of Dissimilar Materials (Continuing for the Second Year Study)
Lee, T.-H. (PI)
1/08/16 → 31/07/17
Project: Research