Multifunctional integrated substrate technology for high density SOP packaging
Fuhan Liu, Rao R. Tummala, Venky Sundaram, Daniel Guidotti, Zhaoran Huang, Y. J. Chang, Isaac Robin Abothu, P. M. Raj, Swapan Bhattacharya, Devarajan Balaraman, G. K. Chang
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
4Scopus
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