Multifunctional integrated substrate technology for high density SOP packaging

Fuhan Liu, Rao R. Tummala, Venky Sundaram, Daniel Guidotti, Zhaoran Huang, Y. J. Chang, Isaac Robin Abothu, P. M. Raj, Swapan Bhattacharya, Devarajan Balaraman, G. K. Chang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

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Engineering