@inproceedings{327414619e3f42a1a809f85588fa29f0,
title = "Modeling the valuation process of sIlicon intellectual property in the semiconductor industry",
abstract = "The complexity of IC (Integrated Circuit) design increases as semiconductor fabrication miniaturizes. Assembly of the reusable basic components of the IC design process has become valuable in accelerating development and marketing of new IC applications. As a result, the idea of SIP (Silicon Intellectual Property) has emerged to meet this demand. The purpose of this paper is to develop a SIP valuation model. However, assessing such intangible assets cost high and have a time-consuming negotiation process to safeguard performance. After intensive interviews with SIP providers, we model a SIP valuation process, which incorporates with quality signals, links to the SIP info-mediaries, and augments with the industry dynamics. The results are further suggested to support with Internet SIP malls, which are installed to take the advantages of multimedia interface and real-time archive for facilitating the SIP valuation processes.",
keywords = "Contracting, Semiconductor, Silicon intellectual property, Valuation",
author = "Hung, {C. L.} and Su, {Y. H.} and Cheng, {Alfred L.P.}",
year = "2007",
doi = "10.1109/IEEM.2007.4419258",
language = "???core.languages.en_GB???",
isbn = "1424415292",
series = "IEEM 2007: 2007 IEEE International Conference on Industrial Engineering and Engineering Management",
pages = "592--596",
booktitle = "IEEM 2007",
note = "2007 IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2007 ; Conference date: 02-12-2007 Through 04-12-2007",
}