Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects

Chin Ta Chen; Hsu Liang Hsiao; Po Kuan Shen; Guan Fu Lu; Chia Chi Chang; Jen Yu Li; Ajay Nedle; Mount Learn Wu; Hsiao Chin Lan; Yun Chih Lee; Shuo Fu Chang; Yo Shen Lin

doi:10.1117/1.OE.51.11.115005

Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects

Chin Ta Chen, Hsu Liang Hsiao, Po Kuan Shen, Guan Fu Lu, Chia Chi Chang, Jen Yu Li, Ajay Nedle, Mount Learn Wu, Hsiao Chin Lan, Yun Chih Lee, Shuo Fu Chang, Yo Shen Lin

Department of Electrical Engineering

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

The development of a 4-channel x 10-Gbits/s optical interconnect module based on a silicon optical bench (SiOB) is presented. The 4-channel vertical-cavity surface-emitting laser (VCSEL) and photo diode (PD) arrays are flip-chip assembled onto the pedestals of SiOB using Au/Sn solder bumps to form an SiOB-based bi-directional optical subassembly (BOSA) configuration. The optical coupling of VCSEL-to-multi-mode fiber (MMF) and MMF-to-PD without adding coupled optics is -5.2 and -2 dB, respectively. The wide alignment tolerances of 1-dB power variation for the transmitting and receiver parts to be ±15 μm are achieved. The clearly open 10-Gbits/s eye patterns of transmitting part as well as the 10^-12-order bit error rate (BER) at the receiving part verify the proposed SiOB-based module is suitable for the application of 4-channel x 10-Gbits/s optical interconnects.

Original language	English
Article number	115005
Journal	Optical Engineering
Volume	51
Issue number	11
DOIs	https://doi.org/10.1117/1.OE.51.11.115005
State	Published - Nov 2012

Keywords

Fiber optics
Mirrors
Optical communications
Optical interconnect

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Chen, C. T., Hsiao, H. L., Shen, P. K., Lu, G. F., Chang, C. C., Li, J. Y., Nedle, A., Wu, M. L., Lan, H. C., Lee, Y. C., Chang, S. F., & Lin, Y. S. (2012). Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects. Optical Engineering, 51(11), Article 115005. https://doi.org/10.1117/1.OE.51.11.115005

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title = "Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects",

abstract = "The development of a 4-channel x 10-Gbits/s optical interconnect module based on a silicon optical bench (SiOB) is presented. The 4-channel vertical-cavity surface-emitting laser (VCSEL) and photo diode (PD) arrays are flip-chip assembled onto the pedestals of SiOB using Au/Sn solder bumps to form an SiOB-based bi-directional optical subassembly (BOSA) configuration. The optical coupling of VCSEL-to-multi-mode fiber (MMF) and MMF-to-PD without adding coupled optics is -5.2 and -2 dB, respectively. The wide alignment tolerances of 1-dB power variation for the transmitting and receiver parts to be ±15 μm are achieved. The clearly open 10-Gbits/s eye patterns of transmitting part as well as the 10-12-order bit error rate (BER) at the receiving part verify the proposed SiOB-based module is suitable for the application of 4-channel x 10-Gbits/s optical interconnects.",

keywords = "Fiber optics, Mirrors, Optical communications, Optical interconnect",

author = "Chen, {Chin Ta} and Hsiao, {Hsu Liang} and Shen, {Po Kuan} and Lu, {Guan Fu} and Chang, {Chia Chi} and Li, {Jen Yu} and Ajay Nedle and Wu, {Mount Learn} and Lan, {Hsiao Chin} and Lee, {Yun Chih} and Chang, {Shuo Fu} and Lin, {Yo Shen}",

note = "Funding Information: This work was supported by Ministry of Economic Affair of the Republic of China under Grant No. 96-EC-17-A-07-S1-001.",

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journal = "Optical Engineering",

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T1 - Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects

AU - Chen, Chin Ta

AU - Hsiao, Hsu Liang

AU - Shen, Po Kuan

AU - Lu, Guan Fu

AU - Chang, Chia Chi

AU - Li, Jen Yu

AU - Nedle, Ajay

AU - Wu, Mount Learn

AU - Lan, Hsiao Chin

AU - Lee, Yun Chih

AU - Chang, Shuo Fu

AU - Lin, Yo Shen

N1 - Funding Information: This work was supported by Ministry of Economic Affair of the Republic of China under Grant No. 96-EC-17-A-07-S1-001.

PY - 2012/11

Y1 - 2012/11

N2 - The development of a 4-channel x 10-Gbits/s optical interconnect module based on a silicon optical bench (SiOB) is presented. The 4-channel vertical-cavity surface-emitting laser (VCSEL) and photo diode (PD) arrays are flip-chip assembled onto the pedestals of SiOB using Au/Sn solder bumps to form an SiOB-based bi-directional optical subassembly (BOSA) configuration. The optical coupling of VCSEL-to-multi-mode fiber (MMF) and MMF-to-PD without adding coupled optics is -5.2 and -2 dB, respectively. The wide alignment tolerances of 1-dB power variation for the transmitting and receiver parts to be ±15 μm are achieved. The clearly open 10-Gbits/s eye patterns of transmitting part as well as the 10-12-order bit error rate (BER) at the receiving part verify the proposed SiOB-based module is suitable for the application of 4-channel x 10-Gbits/s optical interconnects.

AB - The development of a 4-channel x 10-Gbits/s optical interconnect module based on a silicon optical bench (SiOB) is presented. The 4-channel vertical-cavity surface-emitting laser (VCSEL) and photo diode (PD) arrays are flip-chip assembled onto the pedestals of SiOB using Au/Sn solder bumps to form an SiOB-based bi-directional optical subassembly (BOSA) configuration. The optical coupling of VCSEL-to-multi-mode fiber (MMF) and MMF-to-PD without adding coupled optics is -5.2 and -2 dB, respectively. The wide alignment tolerances of 1-dB power variation for the transmitting and receiver parts to be ±15 μm are achieved. The clearly open 10-Gbits/s eye patterns of transmitting part as well as the 10-12-order bit error rate (BER) at the receiving part verify the proposed SiOB-based module is suitable for the application of 4-channel x 10-Gbits/s optical interconnects.

KW - Fiber optics

KW - Mirrors

KW - Optical communications

KW - Optical interconnect

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DO - 10.1117/1.OE.51.11.115005

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Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects

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