Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu; Chih Chen; C. N. Liao; K. N. Tu

doi:10.1063/1.124276

Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu, Chih Chen, C. N. Liao, K. N. Tu

Department of Chemical and Materials Engineering

Research output: Contribution to journal › Article › peer-review

171 Scopus citations

Abstract

Under room temperature electromigration, hillock and void formations were observed in a eutectic SnPb solder stripe. At the anode, hillocks originated from the Pb grains and were extruded under a compressive stress due to the incoming flux of Sn atoms. The morphology of the voids at the cathode also indicates that the Sn grains were depleted during the process.

Original language	English
Pages (from-to)	58-60
Number of pages	3
Journal	Applied Physics Letters
Volume	75
Issue number	1
DOIs	https://doi.org/10.1063/1.124276
State	Published - 5 Jul 1999

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title = "Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes",

abstract = "Under room temperature electromigration, hillock and void formations were observed in a eutectic SnPb solder stripe. At the anode, hillocks originated from the Pb grains and were extruded under a compressive stress due to the incoming flux of Sn atoms. The morphology of the voids at the cathode also indicates that the Sn grains were depleted during the process.",

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AU - Liu, C. Y.

AU - Chen, Chih

AU - Liao, C. N.

AU - Tu, K. N.

PY - 1999/7/5

Y1 - 1999/7/5

N2 - Under room temperature electromigration, hillock and void formations were observed in a eutectic SnPb solder stripe. At the anode, hillocks originated from the Pb grains and were extruded under a compressive stress due to the incoming flux of Sn atoms. The morphology of the voids at the cathode also indicates that the Sn grains were depleted during the process.

AB - Under room temperature electromigration, hillock and void formations were observed in a eutectic SnPb solder stripe. At the anode, hillocks originated from the Pb grains and were extruded under a compressive stress due to the incoming flux of Sn atoms. The morphology of the voids at the cathode also indicates that the Sn grains were depleted during the process.

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JO - Applied Physics Letters

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Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

Abstract

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