Massive spalling in Pb-free solder on co-based surface finishes

Chun Hao Huang, Yi Ling Tsai, Yu Ting Chang, Albert T. Wu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This paper investigates massive spalling that occurs in the intermetallic compounds at the interfaces between Pb-free SAC 305 and Co-based surface finishes. The SAC 305 solders were reflowed on the Co-based substrates and aged at different conditions. The samples were cross-sectioned to study the interfacial morphology. The occurrence of massive spalling depends on the constituents of the substrates. Shear tests were performed on the samples to evaluate the influence of massive spalling on the mechanical strength of the joints. The results indicated that massive spalling did not deteriorate the joint strength.

Original languageEnglish
Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages586-589
Number of pages4
ISBN (Electronic)9784904090138
DOIs
StatePublished - 20 May 2015
Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
Duration: 14 Apr 201517 Apr 2015

Publication series

NameICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

Conference

Conference2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
Country/TerritoryJapan
CityKyoto
Period14/04/1517/04/15

Keywords

  • Cobalt
  • massive spalling
  • shear strenrth
  • surface finish

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