Low vacuum wafer bonding

Keyphrases

• Wafer Bonding 100%
• Low Vacuum 100%
• Annealing 60%
• Wafer 60%
• Bonding Interface 60%
• Bond Energy 40%
• Silicon Wafer 20%
• Coefficient of Thermal Expansion 20%
• Micro-electro-mechanical Systems 20%
• Thermal Stress 20%
• Strong Bond 20%
• Covalent Bond 20%
• Hydrophilic Surface 20%
• Intimate Contact 20%
• Bonding Surface 20%
• Pair Bond 20%
• Dissimilar Materials 20%
• Vacuum Bonding 20%
• Vacuum Storage 20%
• Low Vacuum Annealing 20%
• Thermal Silicon Dioxide 20%
• Vacuum Effect 20%

Engineering

• Energy Engineering 100%
• Wafer Bonding 100%
• Silicon Wafer 50%
• Microelectromechanical System 50%
• Torr 50%
• Thermal Stress 50%
• Expansion Coefficient 50%
• Silicon Oxide 50%
• Hydrophilic Surface 50%
• Covalent 50%