This study presents a structure design and process method for lens type LED package. Dome type or side-emittingenhancement silicone lens without molding process are achieved. The ceramic ring is adopted as the confine for the encapsulant. The surface intension along the sidewall of ceramic ring and silicone surface, the cohesion force and the gravity of silicone determine the shape of dome type silicone lens. The cone shape tooling coated with a releasing material is immersed into the dome type silicone lens before the silicone fully hardening. After curing simultaneously, to remove the tooling from package, the package with side-emitting-enhancement silicone lens is finished. With the mentioned architecture and process, this LED package herein has three merits, (1) to improve light extraction efficiency: reduce the chance of total internal reflection by the geometry of dome type silicone lens. (2)To enhance the flexibility of LED package design, the die placement location would be constrained by the mold in the traditional package process. (3) Mold-less side-emitting-enhancement silicone lens. Furthermore, two types of cone shape tooling are implemented and compared for side-emitting-enhancement silicone lens. Measurement results show the ratio between the lens high and lens radius could achieve 0.9:1. The view angles of dome type and side-emitting-enhancement LED packaged devices can reach 153° and 180 °, respectively. As using the same brightness grade of LED chip, the luminous flux is increasing 15% as compared the dome type package with the commercial PLCC (Plastic Leaded Chip Carrier) type package. The luminous flux of side-emitting-enhancement LED package decreases 8% as compared with the dome type one.