Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys

J. Y. Wang, Y. K. Tang, C. Y. Yeh, P. J. Chang, Y. X. Lin, E. J. Lin, C. Y. Wu, W. X. Zhuang, C. Y. Liu

Research output: Contribution to journal › Article › peer-review

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Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(2/3)
Liu, C.-Y. (PI)
1/08/19 → 31/07/20
Project: Research
Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(3/3)
Liu, C.-Y. (PI)
1/08/18 → 31/07/19
Project: Research
Development of Cu Recycling for Micro Cu Powders Used in Electronics-Grade Cu Slurry( II )
Cheng, S.-L. (PI)
1/06/18 → 31/05/19
Project: Research