Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys

J. Y. Wang
, Y. K. Tang
, C. Y. Yeh
, P. J. Chang
, Y. X. Lin
, E. J. Lin
, C. Y. Wu
, W. X. Zhuang
, C. Y. Liu

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

3 results

Filter

Finished
Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(2/3)
Liu, C.-Y. (PI)
1/08/19 → 31/07/20
Project: Research
Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(3/3)
Liu, C.-Y. (PI)
1/08/18 → 31/07/19
Project: Research
Development of Cu Recycling for Micro Cu Powders Used in Electronics-Grade Cu Slurry( II )
Cheng, S.-L. (PI)
1/06/18 → 31/05/19
Project: Research