Is 3D integration an opportunity or just a hype?

Jin Fu Li, Cheng Wen Wu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

28 Scopus citations

Abstract

Three-dimensional (3D) integration using through silicon via (TSV) is an emerging technology for integrated circuit designs. 3D integration technology provides numerous opportunities to designers looking for more cost-effective system chip solutions. In addition to stacking homogeneous memory dies, 3D integration technology supports heterogeneous integration of memories, logic, sensors, etc. It eases the interconnect performance limitation, provides higher functionality, results in small form factor, etc. On the other hand, there are challenges that should be overcome before volume production of TSV-based 3D ICs becomes possible, e.g., technological challenges, yield and test challenges, thermal and power challenges, infrastructure challenges, etc.

Original languageEnglish
Title of host publication2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
Pages541-543
Number of pages3
DOIs
StatePublished - 2010
Event2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010 - Taipei, Taiwan
Duration: 18 Jan 201021 Jan 2010

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
Country/TerritoryTaiwan
CityTaipei
Period18/01/1021/01/10

Fingerprint

Dive into the research topics of 'Is 3D integration an opportunity or just a hype?'. Together they form a unique fingerprint.

Cite this