TY - GEN
T1 - Is 3D integration an opportunity or just a hype?
AU - Li, Jin Fu
AU - Wu, Cheng Wen
PY - 2010
Y1 - 2010
N2 - Three-dimensional (3D) integration using through silicon via (TSV) is an emerging technology for integrated circuit designs. 3D integration technology provides numerous opportunities to designers looking for more cost-effective system chip solutions. In addition to stacking homogeneous memory dies, 3D integration technology supports heterogeneous integration of memories, logic, sensors, etc. It eases the interconnect performance limitation, provides higher functionality, results in small form factor, etc. On the other hand, there are challenges that should be overcome before volume production of TSV-based 3D ICs becomes possible, e.g., technological challenges, yield and test challenges, thermal and power challenges, infrastructure challenges, etc.
AB - Three-dimensional (3D) integration using through silicon via (TSV) is an emerging technology for integrated circuit designs. 3D integration technology provides numerous opportunities to designers looking for more cost-effective system chip solutions. In addition to stacking homogeneous memory dies, 3D integration technology supports heterogeneous integration of memories, logic, sensors, etc. It eases the interconnect performance limitation, provides higher functionality, results in small form factor, etc. On the other hand, there are challenges that should be overcome before volume production of TSV-based 3D ICs becomes possible, e.g., technological challenges, yield and test challenges, thermal and power challenges, infrastructure challenges, etc.
UR - http://www.scopus.com/inward/record.url?scp=77951239673&partnerID=8YFLogxK
U2 - 10.1109/ASPDAC.2010.5419826
DO - 10.1109/ASPDAC.2010.5419826
M3 - 會議論文篇章
AN - SCOPUS:77951239673
SN - 9781424457656
T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
SP - 541
EP - 543
BT - 2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
T2 - 2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
Y2 - 18 January 2010 through 21 January 2010
ER -