Intra-channel reconfigurable interface for TSV and micro bump fault tolerance in 3-d RAMs
- Kuan Te Wu
- , Jin Fu Li
- , Yun Chao Yu
- , Chih Sheng Hou
- , Chi Chun Yang
- , Ding Ming Kwai
- , Yung Fa Chou
- , Chih Yen Lo
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
2
Scopus
citations