Intra-channel reconfigurable interface for TSV and micro bump fault tolerance in 3-d RAMs

Kuan Te Wu, Jin Fu Li, Yun Chao Yu, Chih Sheng Hou, Chi Chun Yang, Ding Ming Kwai, Yung Fa Chou, Chih Yen Lo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Fingerprint

Dive into the research topics of 'Intra-channel reconfigurable interface for TSV and micro bump fault tolerance in 3-d RAMs'. Together they form a unique fingerprint.

Engineering & Materials Science