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Intra-channel reconfigurable interface for TSV and micro bump fault tolerance in 3-d RAMs
Kuan Te Wu, Jin Fu Li, Yun Chao Yu, Chih Sheng Hou, Chi Chun Yang, Ding Ming Kwai, Yung Fa Chou, Chih Yen Lo
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1
Scopus
citations