Abstract
By die-attaching GaN-based light-emitting diodes (LEDs) on Si substrates with eutectic AuSn solder, the external quantum efficiency of the LEDs was enhanced by 3.5% at a current input of 120 A/cm2. The enhancement of the external quantum efficiency of the die-attached LED chips is attributed to a reduction in compressive stress and piezoelectric fields in quantum wells after eutectic AuSn die-attachment. Raman and photoluminescence analyses were used to estimate the reduction in compressive stress and piezoelectric field in quantum wells, which is 277.8 MPa and 0.056 MV/cm, respectively, after AuSn die-attachment.
Original language | English |
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Article number | 6828707 |
Pages (from-to) | 1793-1796 |
Number of pages | 4 |
Journal | IEEE Photonics Technology Letters |
Volume | 26 |
Issue number | 18 |
DOIs | |
State | Published - 15 Sep 2014 |
Keywords
- GaN light-emitting diode (LED)
- internal quantum efficiency
- piezoelectric field
- stress