Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Tsan Hsien Tseng; Chih Han Yang; Jeng Yu Chiang; Jyun Jhe Huang; Chih Hao Chen; Shih Kang Lin; Chang Meng Wang; Albert T. Wu

doi:10.1016/j.msea.2019.05.074

Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Tsan Hsien Tseng, Chih Han Yang, Jeng Yu Chiang, Jyun Jhe Huang, Chih Hao Chen, Shih Kang Lin, Chang Meng Wang, Albert T. Wu

Department of Chemical and Materials Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn₂, Cu₁₁In₉, and Cu₂In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn₂ and Cu₁₁In₉ IMCs formed at the interface phase transfer to Cu₁₁In₉ when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.

Original language	English
Pages (from-to)	506-513
Number of pages	8
Journal	Materials Science and Engineering A
Volume	759
DOIs	https://doi.org/10.1016/j.msea.2019.05.074
State	Published - 24 Jun 2019

Keywords

Bi
In
Interfacial reaction
Low-temperature alloys
Mechanical strength

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10.1016/j.msea.2019.05.074

Develop of Low Temperature Pb-Free Solder and the Study of Warpage on Electronic Packaging Assembled in Low Temperature(3/3)
Wu, T.
1/08/17 → 31/07/18
Project: Research

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title = "Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates",

abstract = "In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn2, Cu11In9, and Cu2In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn2 and Cu11In9 IMCs formed at the interface phase transfer to Cu11In9 when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.",

keywords = "Bi, In, Interfacial reaction, Low-temperature alloys, Mechanical strength",

author = "Tseng, {Tsan Hsien} and Yang, {Chih Han} and Chiang, {Jeng Yu} and Huang, {Jyun Jhe} and Chen, {Chih Hao} and Lin, {Shih Kang} and Wang, {Chang Meng} and Wu, {Albert T.}",

note = "Publisher Copyright: {\textcopyright} 2019 Elsevier B.V.",

year = "2019",

month = jun,

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doi = "10.1016/j.msea.2019.05.074",

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volume = "759",

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TY - JOUR

T1 - Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

AU - Tseng, Tsan Hsien

AU - Yang, Chih Han

AU - Chiang, Jeng Yu

AU - Huang, Jyun Jhe

AU - Chen, Chih Hao

AU - Lin, Shih Kang

AU - Wang, Chang Meng

AU - Wu, Albert T.

PY - 2019/6/24

Y1 - 2019/6/24

N2 - In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn2, Cu11In9, and Cu2In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn2 and Cu11In9 IMCs formed at the interface phase transfer to Cu11In9 when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.

AB - In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn2, Cu11In9, and Cu2In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn2 and Cu11In9 IMCs formed at the interface phase transfer to Cu11In9 when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.

KW - Bi

KW - In

KW - Interfacial reaction

KW - Low-temperature alloys

KW - Mechanical strength

UR - http://www.scopus.com/inward/record.url?scp=85066065651&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2019.05.074

DO - 10.1016/j.msea.2019.05.074

M3 - 期刊論文

AN - SCOPUS:85066065651

SN - 0921-5093

VL - 759

SP - 506

EP - 513

JO - Materials Science and Engineering A

JF - Materials Science and Engineering A

ER -

Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Abstract

Keywords

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Projects

Develop of Low Temperature Pb-Free Solder and the Study of Warpage on Electronic Packaging Assembled in Low Temperature(3/3)

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