Abstract
Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For midtemperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well. (Figure presented).
Original language | English |
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Pages (from-to) | 244-248 |
Number of pages | 5 |
Journal | Materials Research Letters |
Volume | 6 |
Issue number | 4 |
DOIs | |
State | Published - 3 Apr 2018 |
Keywords
- BiTe
- Interfacial reaction
- PbTe
- Thermoelectric (TE) material and module