Inter-firm collaboration for transaction of silicon intellectual property in IC design service industry

Yea Huey Su, Chia Liang Hung, Li Ping Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

With the advances in semiconductor process technology and the trend of "system on a chip" or "system in package," silicon intellectual property (IP), which is a reusable IC design component, has become an important approach for 1C design. Since most IP providers have different IP technology and core competences, more and more IP providers start to collaborate with one another in order to obtain complementary resources or abilities to provide complete IC design solutions to customers. However, the academic understanding of this issue is still a puzzle. This research then intends to answer the research question: Why does the inter-firm collaboration, a special type of networks, mostly occur for the transaction of silicon intellectual property in the semiconductor industry? By exploring five typical cases, we find that the most common inter-firm collaboration models and difficulties of collaboration between the design service providers and other types of third-party IP providers with different business models. Transaction cost theory is then imported to interpret why the collaboration will mostly occur and how to solve the difficulties during the collaboration process.

Original languageEnglish
Title of host publicationIEMC 2005
Subtitle of host publication2005 IEEE International Engineering Management Conference, Proceedings
Pages902-906
Number of pages5
DOIs
StatePublished - 2005
EventIEMC 2005: 2005 IEEE International Engineering Management Conference - St. John's, Newfoundland, Canada
Duration: 11 Sep 200513 Sep 2005

Publication series

NameIEEE International Engineering Management Conference
VolumeII

Conference

ConferenceIEMC 2005: 2005 IEEE International Engineering Management Conference
Country/TerritoryCanada
CitySt. John's, Newfoundland
Period11/09/0513/09/05

Keywords

  • Co-opetition
  • Design service
  • Inter-firm collaboration
  • Silicon intellectual property (IP)
  • Total solution
  • Transaction cost

Fingerprint

Dive into the research topics of 'Inter-firm collaboration for transaction of silicon intellectual property in IC design service industry'. Together they form a unique fingerprint.

Cite this