Hybrid interconnects using silicon/FR-4 substrates for board-level 10 Gb/s signal broadcasting

Yin Jung Chang, Daniel Guidotti, Lixi Wan, Gee Kung Chang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

An opto/digital interconnect prototype for board-level 1×4 optical-to-digital signal broadcasting operating at 10 Gb/s per channel over an interconnect distance of 10 cm is demonstrated. An improved 1 × 4 multimode interference (MMI) splitter at 1550 nm with linearly-tapered output facet is heterogeneously integrated with 4 p-i-n photodetectors (PDs) on a Silicon (Si) bench. The Si bench itself is hybrid integrated onto an FR-4 printedcircuit board (PCB) with 4 receiver channels. A novel fabrication/integration approach demonstrates the capability of simultaneously aligning multiple polymer waveguides with multiple optoelectronic (OE) devices during the waveguide fabrication process. The combined excess loss of the MMI splitter and the miorr loss per channel is less than 3.5 dB and the entire system is fully functional at 10 Gb/s.

Original languageEnglish
Title of host publication2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06
Pages161-165
Number of pages5
StatePublished - 2006
Event2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06 - Shanghai, China
Duration: 27 Jun 200628 Jun 2006

Publication series

Name2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06

Conference

Conference2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06
Country/TerritoryChina
CityShanghai
Period27/06/0628/06/06

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