Hybrid integration of end-to-end optical interconnects on printed circuit boards

Zhaoran Rena Huang, Daniel Guidotti, Lixi Wan, Yin Jung Chang, Jianjun Yu, Jin Liu, Hung Fei Kuo, Gee Kung Chang, Fuhan Liu, Rao R. Tummala

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

This paper discusses the integration of an end-to-end optical interconnect testbed on printed circuit boards using inexpensive off-the-shelf, bare die, optoelectronic components. We developed a process for efficient and simultaneous in-plane optical coupling between edge emitting laser and waveguides, and between photodetector and waveguide. We demonstrated an optically smooth buffer layer separating the printed circuit layer from the optical transport layer. The demonstrated radically new optical interconnect technology, which we refer to as interface optical coupling, is able to efficiently and simultaneously form optical interfaces between waveguides, lasers and photodetectors by photolithographic technique, thereby eliminating the need for micro-lenses and manual alignment. The measured laser to waveguide coupling efficiency is 45% and measured waveguide to photodetector coupling is 35%. The optical link is demonstrated to operate at 10 Gbps.

Original languageEnglish
Pages (from-to)708-715
Number of pages8
JournalIEEE Transactions on Components and Packaging Technologies
Volume30
Issue number4
DOIs
StatePublished - Dec 2007

Keywords

  • Chip-to-chip
  • Embedded devices
  • Embedded systems
  • Optical communication
  • Optical integration
  • Optical interconnect
  • Polymer waveguide
  • Polymers
  • Printed circuit boards
  • Printed circuit boards (PCBs)
  • System-on-package (SOP)
  • Waveguides

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