Highly-selective MOCA lowpass filter designs using glass-based TF-IPD technology

Tsaitzu Lee, Yo Shen Lin, Chia Chun Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work, a thin-film integrated passive device (TF-IPD) technology has been developed to meet the requirements of smaller form factor, lower cost, and faster design cycling time in modern RF front-end application. Two very compact and highly-selective TF-IPD lowpass filter designs for the Multimedia over Coax Alliance (MoCA) application are demonstrated. They are required to pass the CATV-band from 50 to 750MHz, and exhibit very good rejection for frequency higher than 975MHz. Specifically, the Design 1 has an in-band insertion loss of 1.8dB with more than 40dB rejection from 975MHz to 5.8GHz. On the other hand, the Design 2 with a different layout method and thus different coupling effect has an excellent in-band insertion loss of 1.4dB and a flat 30 dB stop-band from 1.4 to 4 GHz. It is thus possible to adjust the coupling within the circuit layout to meet different filter specifications. Both designs have chip sizes around 6 mm2, which are much smaller than the conventional designs based on discrete components. The proposed highly-selective lowpass filter designs can also be applied to mobile communication devices due to their compact size and good performance.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
StatePublished - 2010
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 20 Oct 201022 Oct 2010

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Conference

Conference2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
Country/TerritoryTaiwan
CityTaipei
Period20/10/1022/10/10

Keywords

  • Glass substrate
  • Lowpass filter
  • MoCA
  • Thin-film integrated passive device (TF-IPD)

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