Abstract
This study investigated a normally-off p-GaN/AlGaN/GaN high electron mobility transistor with the extended p-GaN. The optimized recess depth in the AlGaN barrier under the extended region of p-GaN provides improved device characteristics. The influences of recess depth in the AlGaN barrier and the extended length of the p-GaN extension on the threshold voltage (VTH), the maximum drain current (ID,MAX), and breakdown voltage were simulated and studied. The proposed transistor with a 1-μm p-GaN extension and 2-nm recess depth in AlGaN barrier shows improvement on VTH and ID,MAX without degrading the breakdown voltage compared with the device without p-GaN extension. Graphic abstract: The optimized recess depth (TR) in the AlGaN barrier under the extended region of p-GaN provides improved device characteristics. [Figure not available: see fulltext.]
Original language | English |
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Pages (from-to) | 517-522 |
Number of pages | 6 |
Journal | MRS Communications |
Volume | 11 |
Issue number | 4 |
DOIs | |
State | Published - Aug 2021 |
Keywords
- Barrier layer
- Devices
- Electrical properties
- Epitaxy
- Simulation