@inproceedings{ae8002f678574a83b7b9b6bc82fd7a3c,
title = "High reflectivity and thermal-stability Cr-based reflectors and n-type Ohmic contact for GaN-based flip-chip light-emitting diodes",
abstract = "We have investigated the thermal stability of three composite metals on their contact resistivities and luminous intensities for using as the reflector in flip-chip light-emitting diode (FCLED). The composite metals were simultaneously deposited on n-type GaN without alloy to form n-type Ohmic contact and simplify the process. The investigated composite metals were Ti/Al/Ti/Au (30/500/30/300 nm), Cr/Al/Cr/Au (30/500/30/300 nm) and Cr/Ti/Au (500/30/300 nm), respectively. The specific contact resistivity of Ti/Al/Ti/Au, Cr/Al/Cr/Au and Cr/Ti/Au on the n-type GaN Ohmic contact were changed from 5.4×10-4, 6.6×10-4 and 7.7×10 -4 Ω-cm2 to 5.3×10-4, 4.5×10-4 and 1.3×10-4 Ω-cm2 respectively after 500 hours thermal stress at 150°C in the air. After 96 hours of thermal stress, the luminous intensities at 20 mA of these three structures were decreased 6.2%, 11.1% and 1.4%, respectively. Therefore, in addition to maintain good n-type ohmic contact and simplify the process, the Cr/Ti/Au composite metal demonstrates good thermal stability as a reflector in FCLED.",
keywords = "Al, Cr, FCLED, Flip-chip light-emitting diode, GaN",
author = "Hsueh, {Kuang Po} and Chiang, {Kuo Chun} and Wang, {Charles J.} and Hsin, {Yue Ming}",
year = "2006",
doi = "10.1117/12.646154",
language = "???core.languages.en_GB???",
isbn = "0819461636",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Gallium Nitride Materials and Devices",
note = "Gallium Nitride Materials and Devices ; Conference date: 23-01-2006 Through 25-01-2006",
}