High power LED package with vertical structure

Ming Te Lin, Shang Ping Ying, Ming Yao Lin, Kuang Yu Tai, Jyh Chen Chen

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages.

Original languageEnglish
Pages (from-to)878-883
Number of pages6
JournalMicroelectronics Reliability
Volume52
Issue number5
DOIs
StatePublished - May 2012

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