High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems

Gee Kung Chang, Daniel Guidotti, Zhaoran Rena Huang, Lixi Wan, Jianjun Yu, Shashikant Hegde, Hung Fei Kuo, Yin Jung Chang, Fuhan Liu, Fentao Wang, Rao Tummala

Research output: Contribution to journalConference articlepeer-review

7 Scopus citations

Fingerprint

Dive into the research topics of 'High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems'. Together they form a unique fingerprint.

Mathematics

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds