Fusion bonding of copper and silicon at -70 °C by electrochemistry

Po Yen Chien, Lin Cheng, Cheng Ying Liu, Jhong En Li, Benjamin Tien Hsi Lee

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

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基於矽光子技術之快速多模組醫學檢測研發與應用--基於矽光子技術之快速多模組醫學檢測研發與應用(2/4)
Lee, T.
1/08/19 → 31/07/20
Project: Research
Research on Charge-Accumulation Effect of Schottky Barrier on Electrochemistry to Develop the Technology of Anodizing N-Type Silicon in the Dark(2/2)
Lee, T.
1/08/20 → 31/07/21
Project: Research