Fundamental issues in wafer bonding
- U. Gösele
- , Y. Bluhm
- , G. Kästner
- , P. Kopperschmidt
- , G. Kräuter
- , R. Scholz
- , A. Schumacher
- , St Senz
- , Q. Y. Tong
- , L. J. Huang
- , Y. L. Chao
- , T. H. Lee
Research output: Contribution to journal › Article › peer-review
72
Scopus
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