Flow Boiling Heat Transfer Performance Comparison of Skived Straight and CNC Diverging Microchannels Heat Sinks

Fang Chou Lin, Chien Fu Liu, Ming Tsung Yang, Sung Wei Lee, Cheng Hung Hsu, Kuan Fu Sung, Chien Yuh Yang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

SUMMARYFlow reversal and partial dryout are the most severe issue while applying flow boiling in microchannel heat sinks. Some studies have been conducted to resolve this flow reversal problem. One of the most promising design is the diverging channel. This study compared the flow boiling heat transfer performance of refrigerant R-245fa in a 2-pass diverging microchannel heat sink and in a commercialized skived microchannel heat sink. The test results showed that the maximum thermal resistance of the skived straight channel heat sink are from 28% lower to 4.2% higher than that of diverging channel heat sink. The flow pressure drops in the skived channel heat sink are from 30% to 48% higher than those in diverging channel heat sink.

Original languageEnglish
Title of host publication39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781735532530
DOIs
StatePublished - 2023
Event39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2023 - San Jose, United States
Duration: 13 Mar 202317 Mar 2023

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Volume2023-March
ISSN (Print)1065-2221

Conference

Conference39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2023
Country/TerritoryUnited States
CitySan Jose
Period13/03/2317/03/23

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