@inproceedings{d251ddffe2f74b05900bfc1bb3020b5d,
title = "Flow Boiling Heat Transfer Performance Comparison of Skived Straight and CNC Diverging Microchannels Heat Sinks",
abstract = "SUMMARYFlow reversal and partial dryout are the most severe issue while applying flow boiling in microchannel heat sinks. Some studies have been conducted to resolve this flow reversal problem. One of the most promising design is the diverging channel. This study compared the flow boiling heat transfer performance of refrigerant R-245fa in a 2-pass diverging microchannel heat sink and in a commercialized skived microchannel heat sink. The test results showed that the maximum thermal resistance of the skived straight channel heat sink are from 28% lower to 4.2% higher than that of diverging channel heat sink. The flow pressure drops in the skived channel heat sink are from 30% to 48% higher than those in diverging channel heat sink.",
author = "Lin, {Fang Chou} and Liu, {Chien Fu} and Yang, {Ming Tsung} and Lee, {Sung Wei} and Hsu, {Cheng Hung} and Sung, {Kuan Fu} and Yang, {Chien Yuh}",
note = "Publisher Copyright: {\textcopyright} 2023 STEF.; 39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2023 ; Conference date: 13-03-2023 Through 17-03-2023",
year = "2023",
doi = "10.23919/SEMI-THERM59981.2023.10267893",
language = "???core.languages.en_GB???",
series = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2023 - Proceedings",
}