FinFET Plus: A scalable FinFET architecture with 3D air-gap and air-spacer toward the 3nm generation and beyond

C. K. Chiang, H. Pai, J. L. Lin, J. K. Chang, M. Y. Lee, E. R. Hsieh, K. S. Li, G. L. Luo, Osbert Cheng, S. S. Chung

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Scopus citations

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Material Science