Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating

J. C. Lin, S. B. Jang, D. L. Lee, C. C. Chen, P. C. Yeh, T. K. Chang, J. H. Yang

Research output: Contribution to journalArticlepeer-review

34 Scopus citations

Abstract

Micrometer nickel columns were fabricated by a novel process called microanode guided electroplating (MAGE). In the MAGE process, a microanode of platinum (125 νm in diameter) was controlled to move in either continuous or intermittent mode to guide the progress of Ni-electroplating. The microfabrication was guided from the location of a copper substrate that is initially in contact with the microanode to develop a micrometer column and its appearance was determined by the motion mode (i.e., continuous or intermittent) of the microanode. The intermittent MAGE was superior to the continuous one for fabricating micrometer nickel columns with fine surface morphology and uniform diameter. Different models are proposed and they are simulated by the commercial software ANSYS 8.0 to understand the quantitative distribution in the process of MAGE.

Original languageEnglish
Pages (from-to)2405-2413
Number of pages9
JournalJournal of Micromechanics and Microengineering
Volume15
Issue number12
DOIs
StatePublished - 1 Dec 2005

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