Fabrication of interconnection on printed circuit board based on femtosecond two photon polymerization technique

Chao Yi Tai; Shih Yen Cheng

doi:10.1109/ACP.2010.5682699

Fabrication of interconnection on printed circuit board based on femtosecond two photon polymerization technique

Chao Yi Tai, Shih Yen Cheng

Department of Optics and Photonics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

We report on the fabrication and characterization of the interconnection on printed circuited board. Based on femtosecond two photon polymerization technique, the micro-deflector and the optical waveguide can be fabricated simultaneously. Off-plane interconnection is demonstrated, showing a total loss of 1.9dB/cm.

Original language	English
Title of host publication	2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010
Pages	705-706
Number of pages	2
DOIs	https://doi.org/10.1109/ACP.2010.5682699
State	Published - 2010
Event	Asia Communications and Photonics Conference and Exhibition, ACP 2010 - Shanghai, China Duration: 8 Dec 2010 → 12 Dec 2010

Publication series

Name	2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010

Conference

Conference	Asia Communications and Photonics Conference and Exhibition, ACP 2010
Country/Territory	China
City	Shanghai
Period	8/12/10 → 12/12/10

Keywords

Femtosecond
Interconnection
Polymerization
Waveguide

Access to Document

10.1109/ACP.2010.5682699

Cite this

Tai, C. Y., & Cheng, S. Y. (2010). Fabrication of interconnection on printed circuit board based on femtosecond two photon polymerization technique. In 2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010 (pp. 705-706). Article 5682699 (2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010). https://doi.org/10.1109/ACP.2010.5682699

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Tai, CY & Cheng, SY 2010, Fabrication of interconnection on printed circuit board based on femtosecond two photon polymerization technique. in 2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010., 5682699, 2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010, pp. 705-706, Asia Communications and Photonics Conference and Exhibition, ACP 2010, Shanghai, China, 8/12/10. https://doi.org/10.1109/ACP.2010.5682699

Fabrication of interconnection on printed circuit board based on femtosecond two photon polymerization technique. / Tai, Chao Yi; Cheng, Shih Yen.
2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010. 2010. p. 705-706 5682699 (2010 Asia Communications and Photonics Conference and Exhibition, ACP 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - We report on the fabrication and characterization of the interconnection on printed circuited board. Based on femtosecond two photon polymerization technique, the micro-deflector and the optical waveguide can be fabricated simultaneously. Off-plane interconnection is demonstrated, showing a total loss of 1.9dB/cm.

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Fabrication of interconnection on printed circuit board based on femtosecond two photon polymerization technique

Abstract

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Conference

Keywords

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