Abstract
The 8 x 4 cm2 single-sided double-metal p+ i n+ silicon microstrip detectors (SMDs) with coupling capacitors and polysilicon bias resistors were fabricated with the newly developed double-metal processing techniques with different inter-metal dielectrics. The results of using these processing techniques and some features of double-metal process are reported. The characteristics of polysilicon bias resistors obtained with BF2 ion-implantations having various doses and their effects on the leakage currents of SMDs have also been studied.
Original language | English |
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Pages (from-to) | 13-19 |
Number of pages | 7 |
Journal | Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment |
Volume | 405 |
Issue number | 1 |
DOIs | |
State | Published - 1 Mar 1998 |
Keywords
- Double-metal
- IMD (inter-metal dielectric)
- ONO (oxide nitride-oxide)
- PECVD (plasma-enhanced chemical vapor deposition)
- SMD (silicon microstrip detector)
- SOG (spin-on-glass)