Fabrication of an electro-thermal micro gripper using silver-nickel ink

Yao Yun Feng; Shih Jui Chen; Ping Hsun Hsieh

doi:10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink

Yao Yun Feng, Shih Jui Chen, Ping Hsun Hsieh

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

Original language	English
Title of host publication	MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1141-1144
Number of pages	4
ISBN (Electronic)	9781509019731
DOIs	https://doi.org/10.1109/MEMSYS.2016.7421837
State	Published - 26 Feb 2016
Event	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China Duration: 24 Jan 2016 → 28 Jan 2016

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2016-February
ISSN (Print)	1084-6999

Conference

Conference	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Country/Territory	China
City	Shanghai
Period	24/01/16 → 28/01/16

Access to Document

10.1109/MEMSYS.2016.7421837

Development of a 3d Electromagnetic Energy Harvester Ii(1/2)
Chen, S.
1/08/15 → 31/07/16
Project: Research

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Feng, Y. Y., Chen, S. J., & Hsieh, P. H. (2016). Fabrication of an electro-thermal micro gripper using silver-nickel ink. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems (pp. 1141-1144). Article 7421837 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2016.7421837

Feng, Yao Yun ; Chen, Shih Jui ; Hsieh, Ping Hsun. / Fabrication of an electro-thermal micro gripper using silver-nickel ink. MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1141-1144 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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abstract = "This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.",

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Feng, YY, Chen, SJ & Hsieh, PH 2016, Fabrication of an electro-thermal micro gripper using silver-nickel ink. in MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems., 7421837, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2016-February, Institute of Electrical and Electronics Engineers Inc., pp. 1141-1144, 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 24/01/16. https://doi.org/10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink. / Feng, Yao Yun; Chen, Shih Jui; Hsieh, Ping Hsun.
MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1141-1144 7421837 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

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Feng YY, Chen SJ, Hsieh PH. Fabrication of an electro-thermal micro gripper using silver-nickel ink. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1141-1144. 7421837. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink

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Development of a 3d Electromagnetic Energy Harvester Ii(1/2)

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