Fabrication of an electro-thermal micro gripper using silver-nickel ink

Yao Yun Feng, Shih Jui Chen, Ping Hsun Hsieh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

Original languageEnglish
Title of host publicationMEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1141-1144
Number of pages4
ISBN (Electronic)9781509019731
DOIs
StatePublished - 26 Feb 2016
Event29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China
Duration: 24 Jan 201628 Jan 2016

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2016-February
ISSN (Print)1084-6999

Conference

Conference29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Country/TerritoryChina
CityShanghai
Period24/01/1628/01/16

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