Fabrication of an electro-thermal micro gripper using silver-nickel ink

Yao Yun Feng; Shih Jui Chen; Ping Hsun Hsieh

doi:10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink

Yao Yun Feng, Shih Jui Chen, Ping Hsun Hsieh

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

Original language	English
Title of host publication	MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1141-1144
Number of pages	4
ISBN (Electronic)	9781509019731
DOIs	https://doi.org/10.1109/MEMSYS.2016.7421837
State	Published - 26 Feb 2016
Event	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China Duration: 24 Jan 2016 → 28 Jan 2016

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2016-February
ISSN (Print)	1084-6999

Conference

Conference	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Country/Territory	China
City	Shanghai
Period	24/01/16 → 28/01/16

Access to Document

10.1109/MEMSYS.2016.7421837

Development of a 3d Electromagnetic Energy Harvester Ii(1/2)
Chen, S.-J. (PI)
1/08/15 → 31/07/16
Project: Research

Cite this

Feng, Y. Y., Chen, S. J., & Hsieh, P. H. (2016). Fabrication of an electro-thermal micro gripper using silver-nickel ink. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems (pp. 1141-1144). Article 7421837 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2016.7421837

Feng, Yao Yun ; Chen, Shih Jui ; Hsieh, Ping Hsun. / Fabrication of an electro-thermal micro gripper using silver-nickel ink. MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1141-1144 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{3c47f99f0ded4af6a618475314651878,

title = "Fabrication of an electro-thermal micro gripper using silver-nickel ink",

abstract = "This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.",

author = "Feng, {Yao Yun} and Chen, {Shih Jui} and Hsieh, {Ping Hsun}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 ; Conference date: 24-01-2016 Through 28-01-2016",

year = "2016",

month = feb,

day = "26",

doi = "10.1109/MEMSYS.2016.7421837",

language = "???core.languages.en_GB???",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1141--1144",

booktitle = "MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems",

}

Feng, YY, Chen, SJ & Hsieh, PH 2016, Fabrication of an electro-thermal micro gripper using silver-nickel ink. in MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems., 7421837, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2016-February, Institute of Electrical and Electronics Engineers Inc., pp. 1141-1144, 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 24/01/16. https://doi.org/10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink. / Feng, Yao Yun; Chen, Shih Jui; Hsieh, Ping Hsun.
MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1141-1144 7421837 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Fabrication of an electro-thermal micro gripper using silver-nickel ink

AU - Feng, Yao Yun

AU - Chen, Shih Jui

AU - Hsieh, Ping Hsun

PY - 2016/2/26

Y1 - 2016/2/26

N2 - This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

AB - This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

UR - http://www.scopus.com/inward/record.url?scp=84970956314&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2016.7421837

DO - 10.1109/MEMSYS.2016.7421837

M3 - 會議論文篇章

AN - SCOPUS:84970956314

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 1141

EP - 1144

BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016

Y2 - 24 January 2016 through 28 January 2016

ER -

Feng YY, Chen SJ, Hsieh PH. Fabrication of an electro-thermal micro gripper using silver-nickel ink. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1141-1144. 7421837. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink

Abstract

Publication series

Conference

Access to Document

Fingerprint

Projects

Development of a 3d Electromagnetic Energy Harvester Ii(1/2)

Cite this