Exploratory study on emerging integrator business model in engineering chain of the semiconductor industry: Re-integration of vertical disintegration

Yea Husy Su, Ruey Shan Guo, Chia Wen Lo, Dain Xuan Kao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This study attempts to explore the possible new business model in the engineering chain of the semiconductor industry to overcome the challenges of the trend of re-integration of vertical disintegration due to higher design complexity in the nano-CMOS generation. We propose one better alternative that a foundry separates its company into capital/technology intensive section and service integration section. The service integration section can be spin-off from a foundry to run the integrator business model.

Original languageEnglish
Title of host publication2008 International Symposium on Semiconductor Manufacturing, ISSM 2008
Pages37-39
Number of pages3
StatePublished - 2008
Event2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008 - Tokyo, Japan
Duration: 27 Oct 200829 Oct 2008

Publication series

NameIEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
ISSN (Print)1523-553X

Conference

Conference2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008
Country/TerritoryJapan
CityTokyo
Period27/10/0829/10/08

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