Experimental results of a wafer positioning system using machine vision after system calibration

Yi Cheng Chen, Yu Pin Chen, Ju Yi Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

This article proposed calibration results of a real-time wafer positioning system using machine vision. We developed a novel wafer positioning system which comprises two line-shaped beams spreading toward a scattering surface on the way of wafer transfer. A CCD (charge coupled device) camera mounted above the scattering surface takes images, and these images are processed and analyzed to compute the actual position of the wafer center on the blade during the transfer process. A calibration process and linear fitting of the wafer center are proposed to compensate the system errors induced from manufacturing and assembly. Experimental results illustrate that the precision and accuracy of this wafer positioning system have been both improved after calibrating the system errors.

Original languageEnglish
Title of host publication2012 Proceedings of SICE Annual Conference, SICE 2012
PublisherSociety of Instrument and Control Engineers (SICE)
Pages1014-1017
Number of pages4
ISBN (Print)9781467322591
StatePublished - 2012
Event2012 51st Annual Conference on of the Society of Instrument and Control Engineers of Japan, SICE 2012 - Akita, Japan
Duration: 20 Aug 201223 Aug 2012

Publication series

NameProceedings of the SICE Annual Conference

Conference

Conference2012 51st Annual Conference on of the Society of Instrument and Control Engineers of Japan, SICE 2012
Country/TerritoryJapan
CityAkita
Period20/08/1223/08/12

Keywords

  • CCD camera
  • Image Processing
  • Wafer Positioning

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